Environment-Friendly Electronics: Lead-Free Technology
نویسندگان
چکیده
منابع مشابه
Nasa-dod Lead-free Electronics Project: Vibration Test
Vibration testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is a follow-on to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAAlJG-PP) Lead-Free Solder Project which was the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/mi Ii ...
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This paper describes a cost model developed to assess the cost ramifications of the transition from tinlead to lead-free electronic parts. All tin-lead, all lead-free and mixed assembly approaches are considered. The model makes basic assumptions of a fixed generic set of applications, incorporates a cost of plan development, and includes the costs of reprocessing tin lead to lead free and vice...
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As the electronics industry begins to focus upon the tin-silver-copper family of alloys as a viable replacement for tin-lead solders, research needs to be done to determine if any particular alloy is best suited for the broadest range of applications. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in recent y...
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Of special interest in verification are safety properties, which assert that the system always stays within some allowed region. For closed systems, the theoretical properties of safety properties as well as their practical advantages with respect to general properties are well understood. For open (a.k.a. reactive) systems, whose behavior depends on their on-going interaction with the environm...
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PL programs have made signifi cant and continuous use of electronics technology from the very beginning. In fact, the VT fuze was a marvel of the Laboratory’s electronics technology and the ingenuity of its practitioners. Electronics technology at APL can be subdivided into fi ve broad areas: microelectronics and advanced packaging, RF and microwaves, embedded computers and programmable devices...
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2005
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.2070093